X-ray residual stress and retained austenite testing equipment

Stresstech Group offers equipment based on X-ray diffraction and hole-drilling for measuring residual stresses and retained austenite contents.

X-ray diffraction is the conventional and time proven technique for measuring residual stresses. Using the interatomic spacing as the ultimate gage length, the X-ray technique is ideal for and applicable to all crystalline materials, especially for metals, but also for ceramics. It measures the absolute stress without the need for an unstressed sample for calibration.

X-ray equipment

X-ray stress analyzers (X-ray diffractometers) measure the stresses imposed on crystallite material by X-ray, based on the phenomenon known as Bragg's Law.

The models available are:

Our standard X-ray stress analyzer (X-ray diffractometer) consists of the following three components all manufactured by us:

  • main unit
  • goniometer
  • software.

Additionally Xstress systems can be equipped with

Contact us for more information about our customized solutions with manual, semi-automatic & fully automatic systems.

Hole-drilling equipment

Stresstech Group also offers Prism residual stress system, based on hole-drilling technique, for residual stress measurements. Prism dramatically increases the speed of data acquisition over the traditional strain gage hole-drilling technique of measuring residual stress.