X-ray residual stress and retained austenite testing equipment
Stresstech Group offers equipment based on X-ray diffraction and hole-drilling for measuring residual stresses and retained austenite contents.
X-ray diffraction is the conventional and time proven technique for measuring residual stresses. Using the interatomic spacing as the ultimate gage length, the X-ray technique is ideal for and applicable to all crystalline materials, especially for metals, but also for ceramics. It measures the absolute stress without the need for an unstressed sample for calibration.
X-ray stress analyzers (X-ray diffractometers) measure the stresses imposed on crystallite material by X-ray, based on the phenomenon known as Bragg's Law.
The models available are:
Our standard X-ray stress analyzer (X-ray diffractometer) consists of the following three components all manufactured by us:
- main unit
Additionally Xstress systems can be equipped with
- Floor stand for measuring large and complicated parts
- Ring stand for measuring bearing rings
- X-Y unit for easy stress measurements on the surface area of the part (mapping)
- specially equipped table for x-ray
- X-ray elastic constant determination system for determining the Effective X-ray Elastic constant
Contact us for more information about our customized solutions with manual, semi-automatic & fully automatic systems.
Stresstech Group also offers Prism residual stress system, based on hole-drilling technique, for residual stress measurements. Prism dramatically increases the speed of data acquisition over the traditional strain gage hole-drilling technique of measuring residual stress.